Flexible electronics are becoming an important part of modern technology. From wearable health sensors and smart textiles to flexible displays and implantable medical devices, these systems need electronic circuits that can bend, twist, fold and sometimes stretch without breaking. Now, researchers led by Lingxiao Cao have reported a new technique that could make manufacturing these flexible circuits much easier. Called pressure-constrained sonication activation (PCSA) , the method can turn printed particle-based inks into highly conductive circuits in about one second at room temperature —without exposing the flexible material underneath to extreme heat. The technique is particularly interesting because it works with a remarkably broad range of materials, including metals with melting points ranging from near room temperature all the way up to 3,422°C , the melting point of tungsten. The Problem With Printed Metal Circuits Printing electronic circuits directly onto flexible materials...